Indium solder paste

• Exceeds requirements for increased electrical reliability, including SIR performance characteristics.
• Shows consistent print performance over 12 months with refrigerator storage.
• Excellent printing and reflow properties, even after 1 month of room temperature storage.
  
• Delivers excellent print results even after 60 hours of interruption, open on the stencil.
  
• Compatible with Pb and Pb-free solder alloys
  
• Halogen-free according to EN14582 test method

• Inherently chemically compatible with Indium 8.9HF solder paste, Indium 12.8HF is optimized for long-term jetting and microdispense applications.
• 12.8HF was originally formulated for micro-LED applications, but has proven to be useful in a wide range of applications requiring dot diameter/line width deposits down to 80μm.
• Compatible with Indium 8.9HF Solder Pastes series
• Clear residue with minimal flow-out

• Pb-free solution at low temperature
  
• Excellent pressure and release behavior
  
• Particularly clear flux residues after soldering
  
• Exceptional wetting in air, such as nitrogen atmosphere
  
• Halogen-free according to EN14582 test method

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• Excellent drop-shock reliability - comparable to SAC
  
• Oven temperature below 210°C
  
• Melting temperature above 180°C
  
• Good mechanical shear strength up to 150-165°C
  
• Good thermal and electrical conductivity

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